Production Requirements
The recommended soldering temperature profile is as follows:
Figure 4-1[]{#_Toc21491 .anchor} Soldering Profile (Lead-Free)
Heating Stage
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Slope: Maximum 3℃/s
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Temperature Range: 50℃-150℃
Preheating Stage
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Time: 60s-120s
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Temperature Range: 150℃-180℃
Reflow Stage
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Time Above Melting Point (217℃): 40s-60s
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Soldering Peak Temperature: Not exceeding 245℃
Cooling Stage
- Slope: Maximum 4℃/s
+----------------------------------------------------------------------------------------------------------------------+----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------+ | | - To prevent the module from falling off during soldering, do not design the module to be soldered on the back of the board card. | | | | | | - It is recommended to avoid going through a second soldering cycle. | | | | | | - The setting of soldering temperature depends on various factors of the product factory, such as the nature of the main board, solder paste type, solder paste thickness, etc. Please also refer to relevant IPC standards and solder paste specifications. | | | | | | - Since the temperature of leaded soldering is relatively low, if this soldering method is adopted, please give priority to other components on the board card. | | | | | | - The opening method of the stencil must meet the customer's own product design requirements and inspection specifications. The recommended stencil thickness is 0.15mm (it is not recommended to be less than 0.12mm) | +----------------------------------------------------------------------------------------------------------------------+----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------+ | [!] | The stencil design can be optimized according to the customer's production process requirements to ensure manufacturability and reliability during production. | +----------------------------------------------------------------------------------------------------------------------+----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------+